| Issue |
La Houille Blanche
Number 4, Août 2003
|
|
|---|---|---|
| Page(s) | 62 - 66 | |
| DOI | https://doi.org/10.1051/lhb/2003077 | |
| Published online | 01 July 2009 | |
La Houille Blanche, N°4 (Août 2003), pp. 62-66
Conception et réalisation d'un caloduc plat à rainures en silicium
Design and fabrication of flat silicon heat pipes with micro capillary grooves
1
ICEA-DRT-LETI - CEA/GRE, 17 rue des Martyrs, 38054 Grenoble cedex 9
2
LEG - BP 46, 38402 Saint Martin d'Hères cedex
3
CNES - 18 avenue Edouard Belin, 31401 Toulouse cedex 4
Abstract
Increasing power densities in electronic devices are a direct consequence of their miniaturization and perfonnance improvements. Thus, thermal management has become a main issue. In this article, we propose the use of silicon milliature heat pipes with micro capillary grooves to transport high heat flux. Prototypes were fabricated and tested at a dissipated power up to 30 W/cm2.
© Société Hydrotechnique de France, 2003