| Issue |
La Houille Blanche
Number 4, Août 2003
|
|
|---|---|---|
| Page(s) | 75 - 81 | |
| DOI | https://doi.org/10.1051/lhb/2003079 | |
| Published online | 01 July 2009 | |
Fil chaud dans une micro-cavité et capteur de pression en technologie MEMS
Hot wire and pressure sensor in MEMS technology
1
Institut de Microélectronique, Electromagnétisme et Photonique (IMEP), B.P. 257, 38016 Grenoble Cédex 1
2
Laboratoire des Ecoulements Géophysiques et Industriels (LEGI), B.P. 53 X, 38041 Grenoble Cédex
Abstract
In this paper we present a new technology for wall shear stress integrated sensor fabrication. Thanks to the use of appropriate SOI wafers and wafer bonding technique, we found out an innovative technology that provides ultraminiaturized array-sensors needed in numerous microfluidic applications.
© Société Hydrotechnique de France, 2003
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